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适用范围:

1.柔位线路饭(FPC);

2.覆盖膜(CVL);

3.手机摄像头模组(CCD);

4. 指纹模组(BR);

5.实装电路板(PCBA );

6. 半导体芯片模组等的产品外观成型、开窗、分板工艺制程;

7.HDI板;

特点:

1. 客户根据需求选择配置各类型紫外激光器,功率稳定衰减小,无需担心功率衰减对切割质量、速度的影响;

2.集成德国SCANLAB高精度数字扫描振镜与高精度直线电机运动平台;

3.专业切割软件可直接导入CAD制作的DXF图形,并精确按照输入图形切割,所见即所得

4.光路部分优化设计后,可以实现同等功率下速度、效果最优化,同时进行高效防尘处理,有效减少设备停机清洁维护周期;

5.设备采用大理石防震平台,整体结构稳重牢固,一体封闭式结构,为高速度,高精度,高良率生产提供保障;

技术咨询:经理

手      机:18038136593

名称:中能XJ-8010UV 切割机
可在线通过咨询了解详情
 
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■适用范围 Scope of application

柔性线路饭(FPC);

覆盖膜(CVL);

手机摄像头模组(CCD);

指纹模组(BR);

HDI;

实装电路板(PCBA );

半导体芯片模组等的产品外观成型、开窗、分板工艺制程;

未标题-1.png

English

Flexible circuit board(FPC).

Covering membrane(CVL).

Mobile camera module(CCD).

Fingerprint module(BR).

HDI board.

Physical circuit board(PCBA).

Semiconductor chip modules and other product appearance molding, window opening, split-board process

■特点 Characteristic

根据不同场景客制化的紫外激光器,功率稳定衰减小,无需担心功率衰减对切割质量、速度的影响;

集成德国SCANLAB高精度数字扫描振镜与高精度直线电机运动平台;

专业切割软件可直接导入CAD制作的DXF图形,并精确按照输入图形切割,操作简单。

光路部分优化设计后,可以实现同等功率下速度、效果最优化,同时进行高效防尘处理,有效减少设备停机清洁维护周期;

设备采用大理石防震平台,整体结构稳重牢固,一体封闭式结构,为高速度,高精度,高良品率;

软件兼容各类型功能,简单操作,易学易懂,短时间即可学会基本操作;

集成在设备上的真空吸附平台,无需模具或保护板固定,可将待加工基材牢固的固定在位置上,减少了转换产品所花费的时闹;

English

Customers choose to configure various types of UV lasers according to the needs, the power stable decay decreases, and there is no need to worry about the influence of power attenuation on the cutting quality and speed.

Integration of German SCANLAB high-precision digital scanning vibration mirror and high-precision linear motor motion platform.

The professional cutting software can be directly imported into the DXF graphics produced by CAD and cut exactly according to the input graphics.

After the optimized design of the optical circuit, the speed and eect of the same power can be optimized. At the same time, the dust protection treatment can be carried out eciently, eectively reducing the equipment shutdown and cleaning maintenance cycle.

The equipment adopts marble shock-proof platform, the overall structure is stable and rm, and the integrated closed structure provides guarantees for high speed, high precision, and high yield production.

Software is compatible with all types of functions, simple operation, easy to learn and easy to understand, and can learn basic operations in a short time.

Vacuum adsorption platforms integrated into the equipment can be firmly secured to the position of the substrate to be processed without the need for mold or plate fixation, reducing the time taken to convert the product

■机器参数 Parameters

(model)

XJ-8010UV

平台移(Platform  Move Range)

580*580mm

最大切割范(Maximum cutting range)

450 x430mm

平台定位精度(Platform    positioning  accuracy)

±8um

平台重复定位精度(Platform  repeated  positioning    accuracy)

±4um

平台移速度(Platform  moving speed)

2000mm/s

CCD 定位精度(CCD positioning  accuracy)

±3um @200万像素

最小切割线宽(Minimum cut line  width)

<10um

切割尺寸精度(Cutting  dimension precision)

±20um

切割(Cutting taper)

30um

激光器出功率(Laser  output power)

10W

激光波(Laser  wavelength)

355nm紫外)

操作人力(Operation  manpower)

1人(上下料)

(Single  production  capacity)

根据不同品及要求测试

切割厚度(Cutting  thickness)

根据品的材料及激光器

设备使用功耗(Power  consumption  of devices)

220V/10A/50Hz0.4-0.6Mpa⽓源

设备功耗(Device  startup  power consumption)

220V/15A/50Hz

设备尺寸(长//高)(Device  Size(Length / Width   /  Height)

1500mm显示器560MMx1600mmx1550mm警⽰灯320mm

设备重量(Weight of equipment)

2200kg

境要求(Environmental requirements)

室温 18-25℃,湿度<60%


技术咨询:

手       机:18038136593(涂经理)

网       址:http://www.zn-zn.com

地址:深圳市宝安区西乡街道固戍二路中能产业园一楼(直接导航:中能智能产业园

■适用范围 Scope of application

柔性线路饭(FPC);

覆盖膜(CVL);

手机摄像头模组(CCD);

指纹模组(BR);

HDI;

实装电路板(PCBA );

半导体芯片模组等的产品外观成型、开窗、分板工艺制程;

未标题-1.png

English

Flexible circuit board(FPC).

Covering membrane(CVL).

Mobile camera module(CCD).

Fingerprint module(BR).

HDI board.

Physical circuit board(PCBA).

Semiconductor chip modules and other product appearance molding, window opening, split-board process

■特点 Characteristic

根据不同场景客制化的紫外激光器,功率稳定衰减小,无需担心功率衰减对切割质量、速度的影响;

集成德国SCANLAB高精度数字扫描振镜与高精度直线电机运动平台;

专业切割软件可直接导入CAD制作的DXF图形,并精确按照输入图形切割,操作简单。

光路部分优化设计后,可以实现同等功率下速度、效果最优化,同时进行高效防尘处理,有效减少设备停机清洁维护周期;

设备采用大理石防震平台,整体结构稳重牢固,一体封闭式结构,为高速度,高精度,高良品率;

软件兼容各类型功能,简单操作,易学易懂,短时间即可学会基本操作;

集成在设备上的真空吸附平台,无需模具或保护板固定,可将待加工基材牢固的固定在位置上,减少了转换产品所花费的时闹;

English

Customers choose to configure various types of UV lasers according to the needs, the power stable decay decreases, and there is no need to worry about the influence of power attenuation on the cutting quality and speed.

Integration of German SCANLAB high-precision digital scanning vibration mirror and high-precision linear motor motion platform.

The professional cutting software can be directly imported into the DXF graphics produced by CAD and cut exactly according to the input graphics.

After the optimized design of the optical circuit, the speed and eect of the same power can be optimized. At the same time, the dust protection treatment can be carried out eciently, eectively reducing the equipment shutdown and cleaning maintenance cycle.

The equipment adopts marble shock-proof platform, the overall structure is stable and rm, and the integrated closed structure provides guarantees for high speed, high precision, and high yield production.

Software is compatible with all types of functions, simple operation, easy to learn and easy to understand, and can learn basic operations in a short time.

Vacuum adsorption platforms integrated into the equipment can be firmly secured to the position of the substrate to be processed without the need for mold or plate fixation, reducing the time taken to convert the product

■机器参数 Parameters

(model)

XJ-8010UV

平台移(Platform  Move Range)

580*580mm

最大切割范(Maximum cutting range)

450 x430mm

平台定位精度(Platform    positioning  accuracy)

±8um

平台重复定位精度(Platform  repeated  positioning    accuracy)

±4um

平台移速度(Platform  moving speed)

2000mm/s

CCD 定位精度(CCD positioning  accuracy)

±3um @200万像素

最小切割线宽(Minimum cut line  width)

<10um

切割尺寸精度(Cutting  dimension precision)

±20um

切割(Cutting taper)

30um

激光器出功率(Laser  output power)

10W

激光波(Laser  wavelength)

355nm紫外)

操作人力(Operation  manpower)

1人(上下料)

(Single  production  capacity)

根据不同品及要求测试

切割厚度(Cutting  thickness)

根据品的材料及激光器

设备使用功耗(Power  consumption  of devices)

220V/10A/50Hz0.4-0.6Mpa⽓源

设备功耗(Device  startup  power consumption)

220V/15A/50Hz

设备尺寸(长//高)(Device  Size(Length / Width   /  Height)

1500mm显示器560MMx1600mmx1550mm警⽰灯320mm

设备重量(Weight of equipment)

2200kg

境要求(Environmental requirements)

室温 18-25℃,湿度<60%


技术咨询:

手       机:18038136593(涂经理)

网       址:http://www.zn-zn.com

地址:深圳市宝安区西乡街道固戍二路中能产业园一楼(直接导航:中能智能产业园

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